 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| PulseGuard (R) Suppressors Polymeric ESD Suppressors NEW Pb PGB1 Series Lead-Free 0603 Surface Mount ESD Suppressor Product Overview PulseGuard ESD Suppressors help protect sensitive electronic equipment against electrostatic discharge (ESD). They supplement the on-chip protection of integrated circuitry and are best suited for lowvoltage, high-speed applications where low capacitance is important. Data ports utilizing such high-speed protocols as USB 2.0, IEEE1394, HDMI and DVI can benefit from this new technology. PulseGuard suppressors use polymer composite materials to suppress fast-rising ESD transients (as specified in IEC 61000-4-2 and MIL-STD-883C), while adding virtually no capacitance to the circuit. 4 PULSEGUARD(R) SUPPRESSORS Reference Dimensions: Sn 1.60 (.063") 0.076 (.003") MIN 1.04 (.041") REF 0.787 (.031") 0.254 (.010") MIN 0.356 (.014") Features * Lead-Free * Ultra-low capacitance * Low leakage current * Fast response time * Single line of protection * Bi-directional * Withstands multiple ESD strikes * Standard EIA SOCM-1608 package * Compatible with pick-and-place processes * Available in 1,000 and 5,000 piece reels (EIA-RS481) Typical Applications * * * * * * * HDTV Hardware Laptop/Desktop Computers Network Hardware Computer Peripherals Digital Cameras External Storage Set-Top Boxes Reflow Solder 0.508 (.020") Wave Solder 0.762 (.030") 3.05 (1.20") 1.27 (.050") 1.27 (.050") 3.30 (1.30") Ordering Information 0.762 (.030") CATALOG NUMBER PGB1010603MR PGB1010603NR PIECES PER REEL 1,000 5,000 1 Equivalent Circuit 0.762 (.030") 2 Design Consideration Because of the fast rise-time of the ESD transient, placement of PulseGuard suppressors is a key design consideration. To achieve optimal ESD suppression, the devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install PulseGuard suppressors directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. They are connected from signal/data line to ground. 197 w w w. l i t t e l f u s e . c o m PulseGuard (R) Suppressors Polymeric ESD Suppressors Pb PGB1 Series Lead-Free 0603 Surface Mount ESD Suppressor Capacitance vs. Frequency Electrical Characteristics ESD Capability IEC 61000-4-2 Direct Discharge ....................................................8kV IEC 61000-4-2 Air Discharge .......................................................15kV Clamping Voltage1 ..................................................................150V, typical Rated Voltage ........................................................................24VDC, max Capacitance2 ................................................................................0.055 pF Response Time1 ...............................................................................< 1 ns Leakage Current...............................................................................< 1nA ESD Pulse Withstand............................................1,000 pulses, minimum NOTES: 1. 8 kV direct discharge method, per IEC 61000-4-2. 2. Measured at 1 MHz. 70 ** Note: 1,000 fF = 1 pF Capacitance (fF) Trigger Voltage1 ......................................................................500V, typical 60 50 40 0.5 1.0 1.5 2.0 Frequency (GHz) Environmental Specifications Operating Temperature: -65C to +125C. Moisture Resistance, steady state: MIL-STD-833, method 1004.7, 85% RH, 85C, 1000hrs. Thermal Shock: MIL-STD-202, Method 107G, -65C to 125C, 30 min cycle, 10 cycles. Vibration: MIL-STD-202F, Method 201A, (10 to 55 to 10Hz, 1 min. cycle, 2grs each in X-Y-Z) Chemical Resistance: ASTM D-543, 4hrs @ 40C, 3 solutions (H2O, detergent solution, defluxer) Solder leach resistance and terminal adhesion: Per EIA-576 test Carrier Tape Specifications Parts are delivered on 7" (178mm) reel, paper carrier tape Tt Dd + + Ds + + Tw Pd + + + + Ph Physical Specifications Materials: Body: Glass Epoxy Terminations: Tin (Sn) Ct Ps Pw Solderability: MIL-STD-202, Method 208 (95% coverage) DESCRIPTION Ct - Cover tape thickness Dd - Drive hole diameter Ds - Drive hole spacing Pd - Pocket depth Ph - Pocket height Ps - Pocket spacing Pw - Pocket width Tt - Carrier tape thickness Tw - Carrier tape width MEASUREMENT (MM) 0.06 1.50 4.00 0.58 1.85 4.00 1.02 0.65 8.00 Soldering Parameters: Wave solder - 260C, 10 seconds maximum Reflow solder - 260C, 30 seconds maximum Operating Temperature Range: -65C to +125C Packaging Specifications 8mm Tape and Reel per EIA-RS481-1 (IEC 286, part3); 1,000 pieces per reel, add packaging suffix, MR; 5,000 per reel, add packaging suffix NR. w w w. l i t t e l f u s e . c o m 198 |
Price & Availability of PGB1010603MR
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |